13 push - pull lr 135.0 10.0 200.0 0.38 c/w 65 7.2 50.00 1.0 50 0.15 16.00 28.0 465 0.30 70 parameter symbol min typ max units test conditions common source power gain drain efficiency total device dissipation junction to case thermal resistance maximum junction temperature storage temperature dc drain current drain to source voltage gate to source voltage -65 c to 150 c c a v load mismatch tolerance vswr drain to gate voltage relative 0.80 50.00 ids = ma, vgs = 0v v, vgs = 0v ciss crss coss vds = idq = a, vds = v, f = 0.80 bvdss idss drain breakdown voltage v ma pf pf pf common source output capacitance common source feedback capacitance idq = idq = 0.80 350 vgs = 20v, ids = rdson saturation resistance forward transconductance gm vds = 10v, vgs = 5v polyfet rf devices 1110 avenida acaso, camarillo, ca 93012 tel:(805) 484-4210 fax: (805) 484-3393 email:sell@polyfet.com url:www.polyfet.com 350 350 common source input capacitance 70 v igss vgs idsat zero bias drain current gate leakage current gate bias for drain current saturation current 25 ua v mho ohm amp parameter symbol min typ max units test conditions electrical characteristics ( each side ) rf characteristics ( 300.0 absolute maximum ratings ( t = gps 28.0 a, vds = v, f = a, vds = v, f = 28.0 28.0 watts v 1 mhz mhz mhz watts package style 300.0 vds = 0v vgs = 30v vgs = 20v, vds = 10v high efficiency, linear high gain, low noise general description 28.0 vds = a, vgs = vds ids = a db % o o o o o silicon vdmos and ldmos transistors designed specifically for broadband rf applications. suitable for military radios, cellular and paging amplifier base stations, broadcast fm/am, mri, laser driver and others. "polyfet" process features low feedback and output capacitances, resulting in high f transistors with high input impedance and high efficiency. tm t silicon gate enhancement mode rf power transistor ldmos vgs = 0v, f = 1 mhz 28.0 vds = vgs = 0v, f = 1 mhz 28.0 vds = vgs = 0v, f = 1 mhz 28.0 revision 10/01/2007 20 25 c ) watts output ) 200 polyfet rf devices lr301 10:1 rohs compliant
l3b 1 die id & gm vs vg 0.10 1.00 10.00 100.00 0 2 4 6 8 1012141618 vgs in volts id in amps; gm in mhos id gm l3b 1 die capacitance 1 10 100 1000 0 4 8 1216202428 vds in volts capacitance in pfs coss ciss crss lr301 freq=352mhz, vds=28vdc, idq=0.8a 0 50 100 150 200 250 300 350 400 0 5 10 15 20 25 p in in w a tts 11 11.5 12 12.5 13 13.5 14 14.5 15 pout gain efficiency@315w = 67% polyfet rf devices pout vs pin graph capacitance vs voltage id & gm vs vgs iv curve zin zout package dimensions in inches lr301 l3b 1 die iv 0 5 10 15 20 25 30 35 40 45 0 2 4 6 8 101214161820 vds in volts id in amps vg=2v vg=4v vg=6v vg=8v 0 vg=12v 1110 avenida acaso, camarillo, ca 93012 tel:(805) 484-4210 fax: (805) 484-3393 email:sell@polyfet.com url:www.polyfet.com revision 10/01/2007 tolerance .xx +/-0.01 .xxx +/-.005 inches
|
